Conductive Cloth Adhesive Tape for Semiconductor

Conductive Cloth Adhesive Tape is a specialized material used in semiconductor manufacturing and electronics assembly for applications requiring both conductivity and mechanical protection.
Conductive Fabric Layer: Typically made from woven or non-woven metallic fibers (e.g., nickel, copper, or silver-coated polyester/nylon) to provide EMI shielding or static dissipation. Offers flexibility and durability compared to solid metal tapes.
Adhesive Backing: Pressure-sensitive conductive adhesive (often carbon or silver-filled) ensures electrical continuity between surfaces. May be designed for high-temperature resistance (important for semiconductor processes).

Conductive Cloth Adhesive Tape for Semiconductor Features

Good electrical conductivity: it can ensure the realization of stable current conduction between the electronic components within the semiconductor device, reduce the loss in the signal transmission process, and ensure the normal operation of the device.
Excellent electromagnetic shielding: it can effectively block the interference of external electromagnetic waves on semiconductor components, and at the same time prevent the leakage of internally generated electromagnetic waves to avoid the impact on other components.
Good anti-friction properties: in the process of semiconductor manufacturing, assembly and use, it can withstand a certain degree of friction and wear and tear to protect the internal circuitry and components.
Good processability: soft texture, no burrs when slitting, easy to cut, paste and install according to different semiconductor device shapes and sizes

Conductive Cloth Adhesive Tape for Semiconductor Applications

Chip manufacturing: In the chip manufacturing process, it is used in the chip encapsulation link, which can make a good electrical connection between the chip and the encapsulation shell, and at the same time play the role of electromagnetic shielding to improve the stability and reliability of the chip.
Semiconductor packaging test: in the semiconductor packaging test equipment, used to connect the test probe with the packaged semiconductor device, to ensure the accurate transmission of test signals, while preventing electromagnetic interference in the test process.
Circuit board assembly: In the semiconductor circuit board assembly process, it is used for fixing electronic components, connecting lines and shielding electromagnetic interference, which can effectively improve the performance and stability of the circuit board.

Precautions for use
Storage conditions: It should be placed in a cool and dry environment, avoiding high temperature and high humidity to prevent the performance of the tape from degrading.
Pre-use treatment: before use, the tape needs to be warmed back to room temperature to ensure that its adhesion and conductivity to reach the best state.